| 摘要 |
PROBLEM TO BE SOLVED: To obtain a piezoelectric component that eliminates waveform distortion caused by leakage of vibration to a wire loop and where a tensile strength of wire bonding can be ensured even when a thin gold plating layer is employed for electrodes on a substrate. SOLUTION: A node of a piezoelectric element 1 utilizing a length vibration mode is fixed to a substrate 10 via conductive supports 7, 8 and a node of an upper face electrode 6 of the piezoelectric element 1 is connected to an electrode 12a of the substrate 10 through wire bonding by a wire loop 14. A reinforcing adhesive 15 is applied to a connection part of the wire loop 14 to the electrode 12a of the substrate 10 that is a 2nd bond point and cured. The resonance frequency of the wire loop 14 is shifted toward higher frequencies by the adhesive 15 so as to eliminate waveform distortion caused by leakage of vibration to the wire loop. |
