| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC card capable of protecting an IC chip from an outer pressure which is applied at the time of printing or the like, and further improved in printing suitability as well. SOLUTION: The IC card is provided with a first base material packaging an electronic circuit and a second base material on a side opposite to the side of the first base material packaging the electronic circuit at least and has a fine porous synthetic resin film as the outer-most side layer of this first and/or second base material. At one part of the fine porous synthetic resin film at least, information is described with a high quality by various printing methods such as relief printing, offset printing, gravure printing, intaglio printing, flexographic printing and screen printing, for example, a sublimination and fusion thermal transfer type recording method and an ink jet recording method, etc., or combination thereof. |
