发明名称 DRY ETCHING METHOD AND MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To form a gate electrode with a laminated tungsten having a excellent form-controllability, without breaking a gate insulating film. SOLUTION: A polysilicon film 3, reaction barrier film 4 of tungsten nitride, tungsten film 5, and offset film 6 of silicon nitride are sequentially formed on a gate insulating film 2. Then the offset film 6 is etched with a photoresist as a mask. Then with the offset film 6 as a mask, the tungsten film 5 is etched. Here, a mixed gas comprising fluorine group gas, chlorine, oxygen, and nitrogen is used as an etching gas.
申请公布号 JP2000252259(A) 申请公布日期 2000.09.14
申请号 JP19990048638 申请日期 1999.02.25
申请人 SONY CORP 发明人 FUKUDA SEIICHI
分类号 H01L21/302;C23F4/00;H01L21/28;H01L21/3065;H01L21/3213;H01L29/78;(IPC1-7):H01L21/306 主分类号 H01L21/302
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