| 摘要 |
PROBLEM TO BE SOLVED: To provide substrate processing equipment wherein no atmosphere outside a process chamber is sucked nor disturbs the air current in an adjoining process chamber, causing no degradation in process quality for the substrate. SOLUTION: When a substrate W is carried into a dry process chamber 4, a control device 33 actuates a dry air supply mechanism 31 to supply a dry air to an air knife 9, which jets the dry air toward the substrate W, so that the pure water on the both surfaces of the substrate W is blown off and removed. The control device 33 so controls that the dry air supply mechanism 31 is actuated while a damper 35 is fully opened. Thus, the amount of exhaust from the dry process chamber 4 is increased while a condition with little delivery of air current between openings 6 and 8 and the dry process chamber 4 is kept. Further, the control device 33 so controls that the operation of the dry air supply mechanism 31 is stopped while the damper 35 is opened half. Thus, the amount of exhaust from the dry process chamber 4 is reduced while a condition with little delivery of air current between the openings 6 and 8 and the dry process chamber 4 is kept.
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