发明名称 METHOD FOR PRODUCING THIN FILM SEMICONDUCTOR DEVICE
摘要 A method for producing a semiconductor device having a crystalline semiconductor film which contains silicon as a main component, is formed on a substrate, and serves as an active layer, comprising a substrate protective film forming step at which a silicon oxide film to serve as a substrate protective film is formed on the substrate, a first step at which a semiconductor film containing silicon as a main component is formed on the substrate protective film, and a second step at which a pulse laser beam is applied to the semiconductor film, wherein the wavelength of the pulse laser beam ranges from 370 nm to 710 nm. Such a thin film semiconductor device has a high performance and is simply and stably produced through a low-temperature process.
申请公布号 WO0054313(A1) 申请公布日期 2000.09.14
申请号 WO2000JP00161 申请日期 2000.01.14
申请人 SEIKO EPSON CORPORATION;MITSUBISHI DENKI KABUSHIKI KAISHA;MIYASAKA, MITSUTOSHI;OGAWA, TETSUYA;TOKIOKA, HIDETADA;SATOH, YUKIO;INOUE, MITSUO;SASAGAWA, TOMOHIRO 发明人 MIYASAKA, MITSUTOSHI;OGAWA, TETSUYA;TOKIOKA, HIDETADA;SATOH, YUKIO;INOUE, MITSUO;SASAGAWA, TOMOHIRO
分类号 H01L21/20;H01L21/268;H01L21/336;H01L21/77;H01L29/04;(IPC1-7):H01L21/20;H01L29/786 主分类号 H01L21/20
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