| 摘要 |
PROBLEM TO BE SOLVED: To avoid a decrease in inductance without making the coil thicker, the card itself thicker, or decreasing the density of the wire material by spirally winding the wire material around the outer peripheral part of a fusion part between two base materials and joining a wire material end part to a chip. SOLUTION: First and second card main bodies 2a and 2b are stacked and the fused in a specific shape, e.g. elliptically by a fusing means to provide the fusion part 10. Then the outer peripheral part of the fusion part between the 1st and 2nd card main bodies 2a and 2b as the gap part between the 1st and 2nd card main bodies 2a and 2b is wound with the wire material 6 to form the coil 8 having specific width. After the coil 8 is formed, the end part of the wire material 6 of the coil 8 is joined to a semiconductor device for information processing as a chip and the 1st and 2nd card main bodies 2a and 2b and nearly the entire area of a finishing base material used according to a product are fused by using a pressure roller to form the card. |
