| 摘要 |
<p>PROBLEM TO BE SOLVED: To accurately calculate the thickness and volume of solder or the like by using two types of X rays with a different wavelength distribution for picking up an X-ray image, extracting a specific substance contained in a target to be inspected from the X-ray image by differential operation, and comparing a value that is obtained by the differential operation with a value that is obtained by the differential operation after picking up the image of a standard sample. SOLUTION: A main control part 24 controls an X-ray control part 12 and an image control part 2 for picking up two images with a different wavelength distribution, performs a subtraction processing, and converts the concentration value of a solder extraction image to the thickness of solder using a thickness conversion table 23. In the thickness conversion table 23, the subtraction processing of a standard sample is made to create a solder extraction image, and the correspondence relationship between the thickness of the standard sample and the average concentration value of the solder extraction image being measured is written. As a method for calculating a solder volume, first the solder volume is calculated from the inside of the solder extraction image for selecting an inspection region, the sum of the thickness in the selection region is obtained, the sum is multiplied by an area per pixel as the solder volume, and it is judged that the standard sample 4 is conforming if the obtained volume is within a set range.</p> |
