| 摘要 |
PROBLEM TO BE SOLVED: To absorb and dissipate heat generated from power elements among a plurality of electronic parts efficiently through simple arrangement. SOLUTION: Since a plurality of electronic parts mounted on a mother board 60 are contained in respective regions having a matching width dimension in a case 70 of bag structure, heat generated from each electronic part is absorbed and dissipated efficiently through the case 70 having high thermal capacity. Furthermore, since a heat dissipation fin 40 is arranged closely to the inner wall face 72 of the case 70 substantially perpendicular to the mother board 60, heat from the heat dissipation fin 40 side bonded with a ceramic board 10 mounting a drive transistor 21 having especially high heat generation is absorbed and dissipated efficiently on the case 70. Since the gap between the heat dissipation fin 40 and the inner wall face 72 of the case 70 is filled with a silicon based thermally conductive resin 73, absorption and dissipation of generated heat are accelerated on the case 70 side.
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