发明名称 SEMICONDUCTOR MANUFACTURING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide semiconductor equipment, which is easily installed, capable of uniform heating for piping in a heating device for a piping necessary to be heated, preventing disconnection due to locally excessive heating of a heater, and eliminating complicated works during maintenance. SOLUTION: This semiconductor manufacturing equipment in which the pipings of a gas supply system and a gas exhaust system communicated with a reaction tube are heated by a piping heating device, is provided with a piping 10 to be heated that is engaged and pinched with/by a groove 17 provided in two highly thermal-conductive metal heating blocks 18 and 19 and a heating means 23 in the heating block. Further, it is provided with a temperature detector 24, so that the calorific power of the heating means is controlled on the basis of the result obtained by the temperature detector.
申请公布号 JP2000252223(A) 申请公布日期 2000.09.14
申请号 JP19990055695 申请日期 1999.03.03
申请人 KOKUSAI ELECTRIC CO LTD 发明人 OTA TAKEJI
分类号 H01L21/205;C23C16/44;C23C16/455;(IPC1-7):H01L21/205 主分类号 H01L21/205
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