| 摘要 |
<p>A laminated board comprising an insulating layer having both a strength suitable for a structural body and a machinability good enough to make a via hole therein. The laminated board comprises an insulating layer and a conductive layer. The insulating layer includes a simple layer in close contact with the conductive layer and containing a resin component not containing inorganic long fibers and a composite layer in close contact with the opposite side of the simple layer to the conductive layer and containing a resin component and an organic long fiber component. The laminated board has a bottomed hole extending through the insulating layer, having its bottom which is the conductive layer, and made by a laser beam.</p> |
