LIQUID CRYSTAL DISPLAY DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce a chip size of a semiconductor chip by connecting a bump electrode to a connection part of a wiring layer on a first diode anode area of a protective diode pair or a second diode cathode area. SOLUTION: Inner leads(INR) of a tape carrier package(TCP) are connected electrically and mechanically with respective bump electrodes (BMP) of a semiconductor chip (IC). The protective diodes (DO1, DO2) pair for protecting an internal circuit from a noise inputted from the outside to the IC is connected to respective BMPs. At this time, the cathode electrode of the protective diode DO1 for absorbing a positive noise is connected to source potential (first reference potential), and the anode electrode is connected to each BMP electrically. Further, the cathode electrode of the protective diode DO2 for absorbing a negative noise is connected to each BMP, and the anode electrode is connected to ground potential (second reference potential) electrically.