| 摘要 |
PROBLEM TO BE SOLVED: To transfer a suction head at a high speed from a component supply stage to a substrate mounting stage, and mount electronic components at a predetermined plate face position of a circuit board by the suction head with high accuracy. SOLUTION: A two visual field image pick-up camera 3 moves and halts a suction head 1 which attracts an electronic component E to an upward position defined previously of a board mounting stage S2, and wedges between the electronic components E, which sucks and holds the suction head 1 and the plate face of a circuit substrate P mounted on the board mounting stage S2, and a relative position between the electronic components E sucked by the suction head 1 and a part-mounting position reference M provided on the plate face of the circuit board P is caught by the two visual field image pick-up camera 3. The board mounting stage S2 is moved in XY directions by an error therebetween, thereby correcting a mounted position of the electronic parts by the suction head 1. |
