TWO-DIMENSIONAL STRUCTURE INSPECTION METHOD AND DEFECT INSPECTION METHOD

摘要

PROBLEM TO BE SOLVED: To achieve the maximum detection sensitivity and throughput and at the same time inspect an edge die in real time by acquiring the images of first and second bands in a first column, and at the same time by acquiring the image of the first band in a second column with essentially the same direction as the first band in the first column for performing adjacent comparison. SOLUTION: A wafer 30 including a plurality of dies 32 includes at least two columns 34 including first and second columns 36 and 38. Along with first and second bands 42 and 44, a virtual band 40 is an image that is obtained in a stage over an entire wafer 30 or one scanning process of a camera. Also, the virtual band 40 is provided with a smaller width than the total width of the die 32, and at least two virtual bands 40 for covering the entire width of the die 32 are required. The camera first scans a first band 46 of the first column 36 as one portion of the virtual band 42 and then scans the second band 48 of the first column 36 as one portion of the second virtual band 44. Then, the first and second bands 50 and 52 are scanned as each one portion of the virtual bands 42 and 44 regarding the second column 38.