| 摘要 |
<p>PROBLEM TO BE SOLVED: To suppress thermal stress being applied to the joint of a semiconductor package and a printed board due to heat being generated through operation of an electronic apparatus. SOLUTION: A semiconductor element 1 is bonded through a bonding paste 6 onto a film 2 formed with a wiring pattern 3. Since the bonding paste 6 is admixed with spacers 9, interval between the semiconductor element 1 and a printed board being bonded thereto through solder balls 5 is increased. Thermal stress due to difference in the coefficient of thermal expansion between the semiconductor element 1 and the printed board is thereby absorbed through deformation of a material interposed between them and stress being applied to the joint of a semiconductor package and the printed board can be reduced.</p> |
