| 摘要 |
PROBLEM TO BE SOLVED: To provide a large output current with a small size power supply apparatus by enhancing the heat radiation effect. SOLUTION: A front panel 2 and a rear panel 4 are provided almost in parallel keeping an internal between these panels. The panels 2, 4 are respectively in contact with both end portions of a partitioning wall 16. The partitioning wall 16 defines the space between the panels 2, 4 in the upper and lower areas 20, 18. The partitioning wall 16 has an integrated heat radiating body 32 made of a metal material in the position toward the upper area 20. Within the areas 18, 20, a power supply circuit is provided. This power supply circuit includes a semiconductor module 34 mounted on the heat radiating body 32, a heating part 40 arranged in the lower area 18 and non-heating part 42 arranged in the upper area 20. Within the lower area 18, a semiconductor module 34 and a cooling fan 44 for cooling the heating part 40 are also provided.
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