METHOD AND APPARATUS FOR CLEANING WAFER

摘要

PROBLEM TO BE SOLVED: To clean not only the surface of a wafer but also the rear surface thereof simultaneously in same degree without prolonging the cleaning time by arranging tubes each arranged with nozzles for cleaning the rear surface around the wafer including the lower symmetrical position and spraying cleaning fluid slightly upward in the horizontal direction. SOLUTION: Tubes 2 each arranged with nozzles 3 for cleaning the rear surface are arranged around a wafer 10 including the lower symmetrical position and cleaning fluid 4 is sprayed slightly upward in the horizontal direction thus cleaning the surface 10F and the rear surface 10R of the wafer simultaneously. A process hand disposed in a cleaning chamber enables to spray the cleaning fluid over the entire surface and rear surface of the wafer when both sides of the wafer are cleaned. In the cleaning chamber, two tubes 2 are arranged with nozzles 3 at a substantially constant interval allowing passage of the wafer and the process hand in order to spray the cleaning fluid toward the lower part of the wafer passing between the tubes.