| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method and an apparatus, for the soldering of a printed circuit board, in which the installation space can be reduced as much as possible. SOLUTION: In this soldering method for a printed circuit board, an electronic component which is arranged on the printed circuit board is soldered. At this time, a process wherein the level of molten solder inside a molten solder tank 10 is formed as an undulating face composed of many protrusions, the printed circuit board is brought into contact with the undulating face, and the printed circuit boars is moved in its face direction by a prescribed distance is provided. In addition, a process wherein the level of the molten solder is set as a smooth stationary level, and the printed circuit board is brought into contact with the stationary level is provided. |
