SUBSTRATE FOR MOUNTING SEMICONDUCTOR CHIP

摘要

PROBLEM TO BE SOLVED: To provide a substrate for mounting a semiconductor chip which has a high reliability and quality, having no short circuit between wiring patterns formed on both sides of an interposing insulating layer. SOLUTION: A plurality of interconnection layers formed with a wiring pattern are formed with an insulating layer interposed and a semiconductor chip is mounted on the substrate thus fabricated. Between the interconnection layers, the positions of the wiring patterns 3 extended on an end face of the substrate are shifted in the direction vertical to the surfaces of the substrate 1 to prevent overlapping of the wiring patterns.