METHOD AND APPARATUS FOR MOLDING AND MANUFACTURE OF SEMICONDUCTOR DEVICE EMPLOYING IT

摘要

PROBLEM TO BE SOLVED: To stabilize molding while enhancing the quality by preventing the cracking of chips when a semiconductor device employing a thin film wiring board is molded. SOLUTION: Cavities 3a, 4a corresponding to the sealing part of a CSP(chip scale package) are formed in the upper and lower dies 3, 4 of a molding die 11 and the upper die 3 is provided with a suction hole 3c opening to the tape board supporting face 3b forming a part of the cavity 3a. When a resin for sealing a semiconductor chip 20 is injected, a board sucking section 13 provided in a molding apparatus sucks a tape board 21 through the suction hole 3c and applies the tape board 21 tightly to the tape board supporting face 3b of the upper die 3 thus preventing the cracking of chips.