| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor electronic component which is small and has individually sufficient strength. SOLUTION: Related to the manufacturing method, a slot part formation process where, with an electronic circuit 3 formed in a chip expected region on a semiconductor wafer 1, the semiconductor wafer is formed with a slot part 4 so as to divide configuring regions of the electronic circuits, a resin mold process wherein a resin 6 is injected into the slot part formed at the semiconductor wafer in the slot part formation process, and a split process wherein the semiconductor wafer 1 is split into electronic circuit units which comprises the slot part 4 in which the resin is injected in the resin mold process, are provided for a plurality of semiconductor electronic components. The semiconductor electronic component formed like this has been molded with resin in a wafer process, so each has a sufficient strength. Inexpensive semiconductor components are provided due to excellence in mass production. |
