| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost of a multilayer printed wiring board as a whole by a method, wherein the independent filling process and the independent polishing process of a hole-filling resin with respect to a through-hole in conventional cases are reduced so that the production process of a circuit board for an inner layer is simplified. SOLUTION: In this manufacturing method for a circuit board, for an inner layer, as the core member of a multilayer printed wiring board, a process in which a through hole 12 is formed in a copper-clad laminated board is provided. In addition, a process in which a pattern is formed at least on one face of either the surface or the rear of the copper-clad laminated board is provided. In addition, a process in which identical insulating resin is formed inside the through-hole 12 and at least on one face of either the surface or the rear of the copper-clad laminated board is provided. |
