| 摘要 |
PROBLEM TO BE SOLVED: To improve overlay accuracy of a circuit pattern by sharply reducing friction of a stage drive system generated at acceleration/deceleration of a stage. SOLUTION: When a circuit pattern is directly drawn on a semiconductor wafer 9 with an electron beam lithography equipment, a dummy pattern is also drawn on a scribe area SA of the semiconductor wafer 9. The dummy pattern is a through hole, etc., and drawn with light exposure of an extent where resist is not exposed. Since the dummy pattern is not patterned in the scribe area SA, high-speed movement of a stage on which the semiconductor wafer 9 is mounted is prevented without having a bad influence upon a semiconductor chip region CR, so that friction of a stage drive part driving the stage is sharply reduced.
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