发明名称 MANUFACTURE OF CONTACT PROBE FOR INSPECTION OF PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To realize a manufacturing method, for a contact probe, in which the strength of the probe is high and in which the probe can be easily made fine. SOLUTION: A resin layer 5, with which an oxidizing agent is mixed, is formed on a printed circuit board 1. A patterning operation is performed, in such a way that a resist is left on an electrode pad 3 on the printed circuit board 1 by a lithographic technique. Parts other than the required part are removed up to the halfway parts through wet etching operation. In addition, a dry etching operation is performed so as to perform patterning operation. Then, a monomer for a conductive polymer is polymerized in the resin, and a conductive layer is formed into a pattern.
申请公布号 JP2000252624(A) 申请公布日期 2000.09.14
申请号 JP19990055871 申请日期 1999.03.03
申请人 NEC CORP 发明人 ITAGAKI YOSUKE;SATO MASAHARU;KUSUMI HAJIME
分类号 H05K3/40;G01R1/073;H05K3/00;(IPC1-7):H05K3/40 主分类号 H05K3/40
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