SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To reduce the chip size in flip-chip mounting and to simplify chip mounting process. SOLUTION: The semiconductor device comprises a chip supporting substrate 3 for supporting a semiconductor chip 1 by FCA mounting while facing the major surface 1a thereof with a chip supporting face 3b arranged with wire bumps 2 in correspondence with the pads 1c of the semiconductor chip 1, an anisotropic conductive resin 7 provided between the semiconductor chip 1 and the chip supporting substrate 3 in order to sustain the pads 1c and the wire bumps 2 in electrically connected state while keeping mechanical contact between the pads 1c on the semiconductor chip 1 and the wire bumps 2 on the chip supporting substrate 3, and a socket for communicating electrical signals with an external unit. Electrical connection between the pads 1c on the semiconductor chip 1 and the substrate terminals 3a of the chip supporting substrate 3 is made through the wire bumps 2 provided on the substrate terminals 3a of the chip supporting substrate 3.