| 摘要 |
PROBLEM TO BE SOLVED: To use a bus bar also as a heat sink for reduction in circuit impedance, enhancement of current capacity, and reinforcement and downsizing of a printed wiring board by erectly securing the bus bar on the printed wiring board and installing heat producing devices on the bus bar. SOLUTION: A bus bar 3 made of a steel plate or the like, excellent in thermal conductivity, is erectly secured on a printed wiring board 1 by inserting a plurality of projected portions into through holes (a), (b), (c) and (d) formed in a wiring pattern 2, such as an earth wiring pattern and a power supply wiring pattern, demanded of low impedance, and is soldered to the wiring pattern 2. A power amplifying device 4 and the like are installed on the bus bar so that the power amplifying device 4 and the like are cooled by its heat radiating effect and the circuit impedance of the wiring pattern is reduced. Further, other wiring patterns 5 are formed in the printed wiring board areas between the plurality of the projected portions located under the bus bar 3. Thus, the printed wiring board 1 is reduced in size and reinforced.
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