发明名称 SOLDERING OF ELECTRONIC CIRCUIT COMPONENT UNIT, DISPLAY UNIT, AND PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To prevent electrostatic breakdown of a semiconductor, when the semiconductor or a liquid crystal display is automatically soldered in an inert gas. SOLUTION: An electronic circuit component unit 15 comprises a pair of electrode plates and a lead terminal, whose one end is connected to one of this pair of electrode plate and whose other end is connected to an integrated circuit, and when the lead terminal is soldered and mounted to a printed board 2, the nonsoldered surface side is covered with a masking member so as not to be exposed.
申请公布号 JP2000252618(A) 申请公布日期 2000.09.14
申请号 JP19990051788 申请日期 1999.02.26
申请人 KANSEI CORP 发明人 TOMINAGA TAMOTSU
分类号 H05K3/34;H05K1/18;(IPC1-7):H05K3/34 主分类号 H05K3/34
代理机构 代理人
主权项
地址