| 摘要 |
PROBLEM TO BE SOLVED: To keep the positional relationship between the main body of an electronic component and a wiring board in a substantially fixed state by forming a projection to be brought into contact with the wiring board in the main body of an electronic component. SOLUTION: An electronic component 1 is mounted on a wiring board 7. The wiring board 7 is formed on its surface with wiring conductors 8 and 9, on which terminal sections of terminal members 5 and 6 are disposed respectively. Under this condition, soldering is executed to mount the electronic component 1 on the wiring board 7. The main body 2 of the electronic component 1 is formed with a projection 10 to be brought into contact with the wiring board 7. The projection 10 is preferably formed of resin. By bonding the projection 10 on the main body 2 of the electronic component, or hardening or solidifying the projection 10 on the main body 2 of the electronic component, the projection 10 is fixed to the main body 2 of the electronic component.
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