发明名称 SOLDERING EQUIPMENT, SOLDER WITHDRAWING EQUIPMENT, REMOVAL OF OXIDE, AND OXIDE SEPARATION AGENT
摘要 PROBLEM TO BE SOLVED: To prevent the contamination of a soldering equipment by oxidation preventive heat-resisting oil, etc., by making a separation agent for separating the solder and an oxide from each other from either one selected among sodium chloride, a mixture of salt and sesame, rice hulls, and a carbide, or a combination of these. SOLUTION: The wave-formed surface 6 of solder is formed by molten solder reflux by a solder jet equipment. A printed wiring board 30 carried in from the direction shown by an arrow is soldered as specified by the wave-formed surface of solder. An oxide 7 floating on the molten solder is collected by a net basket 9 and then about half of the net basket is raised. Next, a sieve container 10 is waved to dissseminate a separation agent 8 stored in the container 10 on the surface of the oxide 7. Thereafter, the net basket 9 is moved up and down or right and left to move the oxide 7 above or below the surface of the molten solder. The separation agent 8 is either one selected among sodium chloride, a mixture of salt and sesame, rice hulls, and a carbide, or a combination of these.
申请公布号 JP2000252620(A) 申请公布日期 2000.09.14
申请号 JP19990056502 申请日期 1999.03.04
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KAWASHIMA TAIJI;SHIMIZU KAORU
分类号 B23K1/20;B23K1/08;B23K3/06;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/20
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