STRUCTURE AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve the impact resistance of a mounting structure for mounting an area array type semiconductor package, particularly, a CSP in which an integrated circuit is flip chip mounted on a wiring board. SOLUTION: A mounting structure is constructed to mount an area array type semiconductor package in which an integrated circuit 1 is flip chip mounted on a wiring board 7. Both the flip chip mounting section of the semiconductor circuit 1 and the solder-mounting section of the semiconductor package are sealed with a sealing resin 8.