| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a high frequency oscillator where an electric characteristic of an oscillation circuit can easily be adjusted and a light weight, a thin profile, a short length and a small size can also be realized. SOLUTION: In this high frequency oscillator 20 whose oscillation circuit section and negative resistance circuit section are configured as a multi-layer board, a conductor pattern 24a of a resonator RES configuring the oscillation circuit section is placed on a dielectric layer 24 being an inner layer of the multi-layer board, a cavity section 22f is formed onto a solder side being backside layer of an outer layer of the multi-layer board, and the conductor pattern 24a is exposed to the solder side by this cavity section 22f. Thus, the conductor pattern 24a of the resonator RES can be trimmed by using a laser from the solder side of the multi-layer board. Thus, the electric characteristic by the oscillation circuit section and the negative resistance circuit section, especially, the oscillated frequency can easily be adjusted. Since the oscillation circuit section and the negative resistance circuit section are configured as the multi-layer board, the high frequency oscillator 20 with a light weight, a thin profile, a short length and a small size can be realized.</p> |
