发明名称 |
Edge-mountable integrated circuit package and method of attaching the same to a printed wiring board |
摘要 |
<p>An edge-mountable integrated circuit (IC) package and methods of manufacturing and assembling the same onto a printed wiring board (PWB). In one embodiment, the package includes: (1) a substrate having a major surface and a substantially planar edge and (2) a conductive coating having a first region located on a portion of the major surface and a second region located on a portion of the substantially planar edge, the second region being substantially planar to allow the second region to be reflow soldered to the adjoining printed wiring board PWB. <IMAGE></p> |
申请公布号 |
EP1035759(A2) |
申请公布日期 |
2000.09.13 |
申请号 |
EP20000301558 |
申请日期 |
2000.02.28 |
申请人 |
LUCENT TECHNOLOGIES INC. |
发明人 |
ROESSLER, ROBERT J.;WOODS, WILLIAM L., JR. |
分类号 |
H05K1/14;H01L23/498;H05K3/00;H05K3/34;H05K3/36;H05K3/40;H05K3/42;(IPC1-7):H05K3/36 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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