发明名称 |
ADHESIVE TAPE FOR CONNECTING ELECTRONIC COMPONENTS |
摘要 |
<p>An adhesive tape for continuously arranging electronic parts, which comprises a base material and an adhesive layer formed thereon, the adhesive layer comprising from 20 to 150 parts by weight of a rosin resin per 100 parts by weight of a thermoplastic resin having no carboxyl group in side chains. The adhesive tape exhibits good adhesive properties, causing no slippage of the electronic parts, is excellent in impact resistance, and capability of holding the electronic parts even under high temperature and high humidity conditions.</p> |
申请公布号 |
EP1035186(A1) |
申请公布日期 |
2000.09.13 |
申请号 |
EP19970946104 |
申请日期 |
1997.12.04 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
NAGASAKI, KUNIO;ICHIKAWA, HIROKI;TANIMOTO, MASAKAZU;OKUNO, TOSHIMITSU |
分类号 |
C09J7/02;(IPC1-7):C09J7/02 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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