发明名称 Heat transfer device
摘要 PCT No. PCT/JP96/02558 Sec. 371 Date Mar. 5, 1998 Sec. 102(e) Date Mar. 5, 1998 PCT Filed Sep. 6, 1996 PCT Pub. No. WO97/09570 PCT Pub. Date Mar. 13, 1997A hot heat source heat exchanger (1) receives heat from a primary refrigerant circuit (A) to evaporate liquid refrigerant. The hot heat source heat exchanger (1) is connected to a cold heat source heat exchanger (2) through a gas flow pipe (4) and a liquid flow pipe (5). An indoor heat exchanger (3) is connected to the gas flow pipe (4) through a gas pipe (6) and connected to the liquid flow pipe (5) through a liquid pipe (7). Gas refrigerant evaporated in the hot heat source heat exchanger (1) flows into at least the cold heat source heat exchanger (2). In the cold heat source heat exchanger (2), the gas refrigerant is condensed and refrigerant flow with respect to the indoor heat exchanger (3) is changed in accordance with a cooling or a heating operation requested by the indoor heat exchanger. In the indoor heat exchanger (3), refrigerant is condensed or evaporated.
申请公布号 US6116035(A) 申请公布日期 2000.09.12
申请号 US19980029255 申请日期 1998.03.05
申请人 DAIKIN INDUSTRIES, LTD. 发明人 TANAKA, OSAMU;MATSUZAKI, TAKASHI;MIZUTANI, KAZUHIDE;HORI, YASUSHI;INAZUKA, TORU
分类号 F24D7/00;F24F3/06;F24F5/00;F25B1/00;F25B13/00;F25B23/00;F25B25/00;F25B29/00;(IPC1-7):F25B7/00 主分类号 F24D7/00
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