发明名称 High-speed semiconductor sluice assembly and method for passing a semiconductor chip therethrough
摘要 A high-speed sluice assembly and method for transporting semiconductor devices includes a slide along which the semiconductor devices are transported and two independently controlled stoppers which control the transport of the semiconductor devices along the slide. Each of the independently controlled stoppers is connected to a separate actuator. Each of the actuators is also independently controlled. Several sensors are coupled to the slide to determine the position of the semiconductor devices as they are transported along the slide.
申请公布号 US6116463(A) 申请公布日期 2000.09.12
申请号 US19980129684 申请日期 1998.08.05
申请人 TELKAMP, ARNOLD T. M. 发明人 TELKAMP, ARNOLD T. M.
分类号 H05K13/02;H05K13/04;(IPC1-7):B65G59/00;B65H3/30;G07F11/16 主分类号 H05K13/02
代理机构 代理人
主权项
地址