发明名称 Insulated gate semiconductor device and method of manufacturing the same
摘要 The RBSOA of a device is improved. A gate electrode (10) is linked to a p base layer (4) which is formed in a cell region (CR), and a p semiconductor layer (13) is formed to surround the cell region (CR). An emitter electrode (11) is connected to a top surface of a side diffusion region (SD) of the p semiconductor layer (13) and to a top surface of a margin region (MR) which is adjacent to the side diffusion region (SD), through a contact hole (CH). Further, in these regions, an n+ emitter layer (5) is not formed. Most of avalanche holes (H) which are created in the vicinity of the side diffusion region (SD) when a high voltage is applied pass through the side diffusion region (SD), while some of the avalanche holes (H) pass through the margin region (MR) and are then ejected to the emitter electrode (11). Since there is no n+ emitter layer (5) in these paths, a flow of the holes (H) does not conduct a parasitic bipolar transistor. As a result of this, the RBSOA is improved.
申请公布号 US6118150(A) 申请公布日期 2000.09.12
申请号 US19960717722 申请日期 1996.09.23
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 TAKAHASHI, HIDEKI
分类号 H01L29/78;H01L21/336;H01L29/06;H01L29/10;H01L29/739;(IPC1-7):H01L29/76 主分类号 H01L29/78
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