发明名称 POLISHING COMPACT, AND POLISHING SURFACE PLATE AND POLISHING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To improve the efficiency of polishing work while facilitating the processing of the waste polishing liquid by using Mn oxide compact obtained by working the compact of the Mn oxide powder as a polishing compact, and respectively setting bulk density, BET specific surface area, and mean grain diameter in a specific range. SOLUTION: A polishing compact is mainly composed of the Mn oxide, and bulk density of the polishing compact is desirably set in range at 0.4-4.0 g/cm3 so as to hold shape of the polishing compact during the polishing and so as to efficiently obtain a smooth surface of a material to be polished. BET specific surface area is desirably set in a range at 0.2-250 m2/g, and mean diameter is desirably set in a range at 0.005-10 μm so as to easily mold a porous body. Polishing liquid without including free abrasive grains can be used for polishing of a material to be polished, and problem of the waste liquid can be reduced, and while polishing work can be improved.
申请公布号 JP2000246624(A) 申请公布日期 2000.09.12
申请号 JP19990367629 申请日期 1999.12.24
申请人 TOSOH CORP 发明人 KURAMOCHI TOSHIHITO;KUBOTA YOSHITAKA
分类号 B24B37/12;B24B37/14;H01L21/304 主分类号 B24B37/12
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