| 摘要 |
PROBLEM TO BE SOLVED: To obtain a glass ceramic wiring board in which an insulating board having low warp, low undulation or the like is obtained and high adhesive strength between the metalized wiring layer and the glass ceramic insulating board is obtained when it is simultaneously sintered together with the metalized wiring layer such as Cu or the like and which is stably mounted for a long time to an external circuit board and is suitable for various circuit boards and multilayered wiring boards for high frequency or the like. SOLUTION: In a glass-ceramic wiring board comprising a glass-ceramic insulating board 2 and a metalized wiring layer 3 containing Cu as the main component, the glass-ceramic wiring board contains, 55 to 85 wt.% borosilicate glass as glass, 10 to 40 wt.% SiO2 as filler and 0.5 to 10 wt.% GeO2 and has a coefficient of thermal expansion of 7 ppm/ deg.C in the temp. range of 40-400 deg.C. |
