发明名称 HEAT RESISTANT ADHESIVE
摘要 PROBLEM TO BE SOLVED: To obtain a heat resistant adhesive having a long distance among crosslinked points and a low crosslinking density, showing a thermoplastic property, excellent in mechanical characteristics and useful as a high performance material, or the like, by containing a specific crosslinking group- containing polyimide. SOLUTION: This heat resistant adhesive contains a polyimide containing a crosslinking group, which is constituted by containing a recurring unit of formula I [X is p,p'-biphenylene, p,p'-diphenylketone, or the like; R is a tetravalent phenyl, or the like; (m) is 50 mole%<=m<100 mole%], or recurring units of formula I and formula II [Ar is a divalent phenyl, a divalent diphenylsulfone, or the like; (n) is 0 mole%<=n<50mole%] and has its molecular terminal expressed by formula III (Y is a trivalent phenylene, trivalent naphthalene, or the like) and formula IV (T is 1,2-phenylene, 2,3-naphthalene, or the like), where the molar ratio of formula III/formula IV is (1/99)-(80/20).
申请公布号 JP2000248252(A) 申请公布日期 2000.09.12
申请号 JP19990101106 申请日期 1999.04.08
申请人 MITSUI CHEMICALS INC 发明人 OKAWA YUICHI;SAKATA YOSHIHIRO;OKUMURA TOMOMI;SHIBUYA ATSUSHI;KUROKI TAKASHI;OIKAWA HIDEAKI
分类号 C09J179/08;C08G73/10;(IPC1-7):C09J179/08 主分类号 C09J179/08
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