发明名称 |
POLYAMIDE RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition which hardly increases blushing when stored in a highly humid atmosphere, when contacted with water or boiling water or when heated to its glass transition temperature or higher and is excellent in mechanical performances such as impact resistance and the like. SOLUTION: This resin composition comprises 100 pts.wt. of a solid phase- polymerized polyamide obtained by solid phase-polymerization of a polyamide obtained by melt polymerization of diamine components containing at least 70 mole % of m-xylylene diamine and dicarboxylic acid components containing at least 70 mole % of adipic acid, and 0.005-1.0 pts.wt. of at least one compound, added thereto, selected from a diamide compound and a diester compound obtained from an 8-30C fatty acid and a 2-10C diamine or diol.
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申请公布号 |
JP2000248176(A) |
申请公布日期 |
2000.09.12 |
申请号 |
JP19990054234 |
申请日期 |
1999.03.02 |
申请人 |
MITSUBISHI GAS CHEM CO INC |
发明人 |
TAKAHASHI MAKOTO;YAMAMOTO KOJI;MARUYAMA KATSUYA |
分类号 |
B32B27/34;C08G69/30;C08K5/10;C08K5/20;C08L77/06;(IPC1-7):C08L77/06 |
主分类号 |
B32B27/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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