发明名称 Integrated ESD structures for use in ESD circuitry
摘要 Apparatus for use in ESD circuitry are provided that comprise a substrate layer on a dielectric wherein the substrate layer includes a first geometric region comprising alternating regions of first and second conductivity types, a second geometric region of substantially one conductivity type surrounding the first geometric region and a third geometric region of substantially one conductivity type surrounding the second geometric region. The substrate layer further includes at least one dielectric layer on at least the second geometric region and a gate layer on the dielectric layer, over the second geometric region and over at least a portion of the second geometric region that is adjacent the alternating first and second conductivity type regions. In a first aspect of the invention, the alternating first and second conductivity type regions preferably are abutted, and a salicide layer may be employed to coupled together adjacent first and second conductivity type regions if desired. In a second and a third aspect of the invention, the alternating first and second conductivity type regions preferably are separated by shallow trench isolation regions or by polysilicon regions, respectively. The at least one dielectric layer may be thicker in at least one portion of the second geometric region than in another portion of the second geometric region. An ASIC book may be formed from one or more of the apparatus.
申请公布号 US6118155(A) 申请公布日期 2000.09.12
申请号 US19990334078 申请日期 1999.06.16
申请人 INTERNATIOANL BUSINESS MACHINES CORPORATION 发明人 VOLDMAN, STEVEN H.
分类号 H01L27/02;(IPC1-7):H01L23/62;H01L27/01;H01L27/12;H01L31/039 主分类号 H01L27/02
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