Jig for facilitating surface-soldering pin to laminated metal sheet

摘要

A jig for facilitating soldering of elongate pin to a circuit board having laminated first and second layers of metal in predetermined areas is provided and includes a template supported above the circuit board and at least one support frame supported above the template and the circuit board. The template includes legs descending therefrom which define a space therebetween for snugly receiving the circuit board therein. The template has pin receiving holes formed therethrough in respective alignment with the predetermined areas of the circuit board for the elongate pins to extend therethrough to contact the predetermined areas of the circuit board. The support frame includes pin position adjusting sections resiliently extending laterally therefrom and respectively having pin retaining holes formed therein in correspondence to the pin receiving holes of the template. Each pin position adjusting section has a leg depending therefrom and extending through a corresponding anchoring hole of the template for mounting the template to the support frame. Each leg also has a lower end extension which tightly fit into holes formed in the predetermined areas of the circuit board. By that arrangement, the lower end extensions of the legs securely fix the metal layers together during the soldering process and positional variations of elongate pins are accommodated by the resiliency of the pin position adjusting sections.