| 摘要 |
PROBLEM TO BE SOLVED: To obtain a polyamide resin-based hotmelt adhesive composition having a secondary adhesive performance excellent in water resistant creep property, heat resistance, or the like, and capable of remarkably improving both adhesive property and adhesion strength from a low temperature to a normal temperature. SOLUTION: This hotmelt adhesive composition consists of (a) 10-60 wt.%. polyamide resin, (b) 5-60 wt.%. ethylene-vinyl acetate copolymer containing 20-60 wt.%. vinyl acetate or its grafted compound, (c) 10-80 wt.%. thermoplastic elastomer and (d) 1-50 wt.%. magnesium silicate-based compound containing 10-35 wt.%. magnesia and 40-65 wt.%. silica and having 0.01-30μm mean particle diameter.
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