| 摘要 |
PROBLEM TO BE SOLVED: To obtain a composition well-balanced between the mold release characteristics and the flow characteristics even when highly filled with an inorganic filler in particular by heating and kneading the constituents of an epoxy resin composition in a specified order. SOLUTION: In producing an epoxy resin composition for sealing a semiconductor by heating and kneading an epoxy resin, a curing agent, an inorganic filler a mold release agent and a cure accelerator, the epoxy resin, the curing agent and the inorganic filler are preliminarily heated and kneaded beforehand, the kneaded material is blended with the mold release agent and the cure accelerator, and the blend is further heated and kneaded. To blend the mold release agent and the cure accelerator, a method of preliminarily heating and kneading the epoxy resin the curing agent and the inorganic filler, cooling and grinding the kneaded material obtained, and blending the ground material with the mold release agent and the cure accelerator, or a method of adding the mold release agent and the cure accelerator while the epoxy resin, the curing agent and the inorganic filler are preliminarily heated and kneaded can be employed. A flexibilizer, coupling agent, flame retardant, thermoplastic resin, etc. can also be blended in any of the steps with the composition.
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