| 摘要 |
A heat sink with first and second sides are connected to a lead frame. The lead frame has a first group of inner leads having front end portions arranged to make a specific interval with the first side of the heat sink on a horizontal plane and a second group of inner leads having front end portions arranged to make a specific interval with the second side of the heat sink on the horizontal plane. In this stat, the first and second group of the inner leads are connected to a semiconductor chip mounted on the heat sink through several wires. Accordingly, the inner leads and the semiconductor chip can be connected without causing short-circuit between the inner leads and the heat sink.
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