Mechanical assembly for regulating the temperature of an electronic device which incorporates a single leaf spring for self-alignment plus a low initial contact force and a low profile

摘要

A mechanical assembly for regulating the temperature of an integrated circuit chip is comprised of a frame which has two spaced-apart spring supports. A single leaf spring extends from one of the spring supports to the other. A heat exchanger contacts the leaf spring at one point, pushes the leaf spring against the spring supports, and has a face for mating with the chip. And, a stop is provided between the heat exchanger and the frame, which keeps the heat exchanger on the leaf spring. With this assembly the heat exchanger exerts a very small force at its initial point of contact on the chip; the length of the single leaf spring does not add to the profile of the assembly; no slippage occurs between the heat exchanger and the chip; and, the stop prevents the heat exchanger from twisting and becoming offset relative to the chip.