| 摘要 |
In exposure by a scanning exposure system, when the pattern of a reticle is exposed onto shot areas on a wafer while reading ahead to detect the focus positions at read-ahead regions before an exposure region 16, 116 with respect to the scanning direction, (1) for each of shot areas S10, S1-S4, S5, S23, S28, S29-S32 on the peripheral region of the wafer 15, the exposure is performed by scanning the wafer 15 so that a slit-like exposure region 16 moves relatively from the inside to the outside of the wafer 15; or, (2) when the absolute value of the difference between the focus position at the read-ahead region 135 and the focus position of an imaging plane 139 in the exposure region exceeds an allowable value, the height of the wafer 15 is fixed at the height set until then while ignoring the read-ahead data.
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