发明名称 |
Flexible lead structures and methods of making same |
摘要 |
A microelectronic component, such as a connector or a packaged semiconductor device is made by connecting multiple leads between a pair of elements and moving the elements away from one another so as to bend the leads toward a vertically extensive disposition. One of the elements includes a temporary support which is removed after the bending operation and after injecting and curing a dielectric material to form a dielectric layer surrounding and supporting the leads.
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申请公布号 |
US6117694(A) |
申请公布日期 |
2000.09.12 |
申请号 |
US19990267058 |
申请日期 |
1999.03.12 |
申请人 |
TESSERA, INC. |
发明人 |
SMITH, JOHN W.;HABA, BELGACEM |
分类号 |
H01L21/302;(IPC1-7):H01R9/09 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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