| 摘要 |
A process for forming a microstructure at a surface of a substrate made of a ferroelectric single crystal, includes the steps of subjecting the substrate to a single-poling treatment, thereby one of an etching-easy surface and an etching-difficult surface being exposed to one of main faces of the substrate, while the other being exposed to the other main face, forming a domain-inverted region in at least one of the main faces of the substrate, and forming the microstructure at the substrate in the domain-inverted region of the substrate by selectively etching the substrate.
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