发明名称 |
Liquid epoxy resin composition for ball grid array package |
摘要 |
A liquid epoxy resin composition comprising (A) an epoxy resin component which includes specific amounts of three specific epoxy resins, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler has a low viscosity, high cure rate, ease of processing, reliability, and shelf stability. The composition can be used as a semiconductor device encapsulant to provide BGA packages having minimal warpage.
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申请公布号 |
US6117953(A) |
申请公布日期 |
2000.09.12 |
申请号 |
US19990234482 |
申请日期 |
1999.01.21 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
ICHIROKU, NOBUHIRO;SHIOBARA, TOSHIO |
分类号 |
C08G59/38;C08L63/00;H01L23/29;(IPC1-7):C08G59/16;C08L63/02 |
主分类号 |
C08G59/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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