Manufacturing method for electronic devices

摘要

A manufacturing method for electronic devices including applying photosensitive or non-photosensitive resin onto a substrate by a slit-type dropping nozzle method. A slit-type dropping nozzle for performing resin application is scanned to apply resin while maintaining a scanning direction of the nozzle in an inclined condition relative to the substrate at a specified angle in substantially a same direction as a rotating direction of the substrate after resin has been applied thereto. With the above method, even in a case in which clogging of a part of the nozzle due to foreign matter and dropping defects have occurred, the uniformity in film thickness typically will not be affected unless the defect has occurred in the center of the substrate.